UMC introduces Revolutionary 3D IC Solution for RFSOI, Fueling 5G Innovations

United Microelectronics Corporation (UMC), a important semiconductor Foundry, has launched the industry’s first 3D IC solution for RFSOI technology. This breakthrough solution, available on UMC’s 55 nm RFSOI platform, effectively reduces die size by over 45% while maintaining optimal radio frequency (RF) performance. By enabling the integration of more RF components, this innovation addresses the escalating bandwidth demands of 5G technology.

As mobile device manufacturers strive to incorporate more frequency bands into their smartphones, UMC’s 3D IC solution for RFSOI tackles the challenge of integrating additional RF front-end modules (RF-FEM) – crucial components that facilitate data transmission and reception. This is achieved by vertically stacking dies, thereby minimizing surface area. RFSOI is the foundry process utilized for RF chips such as low noise amplifiers, switches, and antenna tuners. UMC’s 3D IC solution for RFSOI employs wafer-to-wafer bonding technology to mitigate RF interference issues that often arise when stacking dies. The company has already secured multiple patents for this process, which is now ready for production.

Raj Verma, Associate Vice President of Technology Development at UMC, expressed pride in leading the industry with their state-of-the-art 3D IC technology for RF-FEM. Verma emphasized that this solution not only addresses the mounting frequency band demands of smartphones in the 5G/6G era but also facilitates faster data transfer in mobile, IoT, and virtual reality devices by accommodating multiple frequency bands in parallel. UMC is committed to further developing stacked die solutions to cater to the RF requirements of future technologies like 5G millimeter-wave.

UMC boasts the most comprehensive range of RF front-end module IC solutions in the industry, catering to diverse applications including mobile, Wi-Fi, automotive, IoT, and satellite communications. With an impressive track record of over 500 product tape-outs and the shipment of more than 38 billion RFSOI chips, UMC’s family of RFSOI solutions is available in 8-inch and 12-inch wafers, as well as various technology nodes ranging from 130 nm to 40 nm. Additionally, UMC’s 6-inch fab, Wavetek Microelectronics Corporation, offers compound semiconductor technologies such as gallium arsenide (GaAs) and gallium nitride (GaN), along with RF filters to complement the RF-FEM applications.

Background Information

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About UMC:

United Microelectronics Corporation (UMC) is a important semiconductor foundry company founded in 1980 by Robert Tsao and others. Headquartered in Hsinchu, Taiwan, UMC has become one of the world's leading semiconductor manufacturing companies, specializing in the production of integrated circuits (ICs) for a diverse range of applications, including consumer electronics, telecommunications, and automotive industries. UMC operates several advanced manufacturing facilities across Taiwan, mainland China, Singapore, and Japan.

  

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Technology Explained

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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