Rapidus to Launch 2nm Pilot Line in April, Eyes 2027 for Mass Production

Big News from Rapidus: A Step Forward in Semiconductor Tech

Exciting times are ahead for the tech world as Rapidus Corporation just scored a major win. The company’s plans and budget for fiscal year 2025 have been given the green light by Japan’s New Energy and Industrial Technology Development Organization (NEDO). This approval is a big deal, covering two ambitious projects under NEDO’s “Post-5G Information and Communication Systems Infrastructure Enhancement R&D Project.” So, what exactly does this mean for the future of semiconductors? Let’s break it down.

Two Projects, One Vision

The approved projects are all about pushing the boundaries of semiconductor technology. The first initiative focuses on the Research and Development of 2 nm-Generation Semiconductor Integration Technology and aims to streamline manufacturing processes through Japan-U.S. collaboration. This isn’t just theoretical; Rapidus has been hard at work since November 2022, building the Innovative Integration for Manufacturing (IIM) facility in Chitose, Hokkaido. This facility will be the heart of their production efforts.

But that’s not all. Rapidus has been sending engineers to work alongside IBM in the U.S., diving deep into the nitty-gritty of 2 nm logic semiconductor mass production. They’re not just dreaming; they’re hitting performance targets and installing EUV lithography equipment at their IIM facility. Cleanroom operations have kicked off, and the company is already celebrating achievements for FY2024. Impressive, right?

Back-End Innovations on the Horizon

Now, let’s talk about the second project, which is all about back-end processes. Launched in March 2024, this initiative is set to revolutionize chiplet packages, making them larger and more power-efficient with 2 nm-generation semiconductors. To pull this off, Rapidus is establishing design kits and testing technologies that are crucial for mass production.

The international collaboration is noteworthy, too. Rapidus is teaming up with big names like IBM, Fraunhofer in Germany, and A*STAR IME in Singapore. Together, they’ve already nailed down the basic process flow and selected equipment in FY2024. Plus, a new R&D base, the Rapidus Chiplet Solutions (RCS), is in the works at Seiko Epson Corporation’s Chitose Plant. Exciting developments are underway as preparations for RCS have been rolling since October 2024.

What’s Next for Rapidus?

With NEDO’s approval, Rapidus is gearing up to launch its pilot line in April. This will involve the manufacturing equipment already set up in the front-end process area. The plan? To develop prototype 2 nm Gate-All-Around (GAA) transistors on 300 mm wafers and provide a Process Design Kit (PDK) for early customers. It’s all about creating an environment where customers can start prototyping their own innovations.

On the back-end side, the RCS site will kick off its own pilot line in April, focusing on mass production techniques. Rapidus will also delve into advanced technologies like Redistribution Layer (RDL) interposer tech, 3D packaging techniques, and Assembly Design Kits (ADKs). Quality control methods, including a Known Good Die (KGD) testing flow, will also be a priority.

A Message from the Top

Dr. Atsuyoshi Koike, the representative director and CEO of Rapidus Corporation, expressed his enthusiasm about the progress: “The construction of the IIM manufacturing facility at Rapidus has progressed smoothly. By the end of last fiscal year, we had completed the installation of the semiconductor manufacturing equipment necessary for the start of pilot operations. We would like to take this opportunity to express our sincere gratitude to the Ministry of Economy, Trade and Industry (METI), NEDO, Hokkaido, Chitose City, and all others for their generous cooperation. With the approval of the NEDO project plan and budget, we will start up the pilot line in April, which will steadily lead to the start of mass production targeted for 2027.”

So, as we look ahead, it’s clear that Rapidus is not just keeping pace with the semiconductor race; they’re setting the stage for a future where technology meets efficient production. Keep your eyes peeled—this is just the beginning!

Background Information

---

About IBM:

IBM, or International Business Machines Corporation, is a globally American multinational technology company with a storied history dating back to its founding in 1911. Over the decades, IBM has consistently been at the forefront of innovation in the field of information technology. The company is known for its pioneering work in computer hardware, software, and services, with breakthroughs like the IBM System/360 and the invention of the relational database.

Latest Articles about IBM

Technology Explained

---

chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

Latest Articles about chiplet

---

EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.

Latest Articles about EUV