Rapidus to Initiate 2nm Pilot Line in April, Eyes 2027 for Mass Production

Big News from Rapidus Corporation

Today, we’ve got some exciting updates from Rapidus Corporation. The company just announced that its plans and budget for fiscal year 2025 have received the green light from Japan’s New Energy and Industrial Technology Development Organization (NEDO). This approval is a big deal, covering two key projects under NEDO’s ambitious “Post-5G Information and Communication Systems Infrastructure Enhancement R&D Project.”

What’s on the Agenda?

So, what exactly are these projects? First up is the “Research and Development of 2 nm-Generation Semiconductor Integration Technology and short TAT (turnaround time) Manufacturing Technology Based on Japan-U.S. Collaboration.” That’s a mouthful, but it essentially focuses on the front-end processes of semiconductor manufacturing. Launched back in November 2022, this project is a cornerstone of Japan’s next-gen semiconductor R&D efforts.

Then there’s the second project, which dives into the “Development of chiplet, Package Design and Manufacturing Technology for 2 nm-Generation Semiconductors.” This one kicked off in March 2024 and aims to create larger, more power-efficient chiplet packages.

Progress in Hokkaido

At the heart of these initiatives is the Innovative Integration for Manufacturing (IIM) facility in Chitose, Hokkaido. Rapidus has been busy constructing this facility, which will serve as a production base. They’ve even sent engineers to the U.S. to collaborate with IBM on developing mass production technologies for 2 nm logic semiconductors. Talk about international teamwork!

The company has also made significant strides in setting up EUV lithography and other essential production equipment at the IIM facility. They’ve officially started cleanroom operations, and thanks to these efforts, Rapidus hit its performance targets for FY2024.

Collaboration is Key

The second project is all about back-end processes, and it’s gaining momentum through international partnerships. Rapidus is working alongside heavyweights like IBM, Fraunhofer from Germany, and A*STAR IME from Singapore. This collaboration has already led to the completion of the basic process flow and equipment selection in FY2024.

But that’s not all! They’re also establishing a new R&D base—Rapidus Chiplet Solutions (RCS)—at Seiko Epson Corporation’s Chitose Plant, right next to the IIM. Preparations for RCS have been in the works since October 2024, and it’s set to play a crucial role in this semiconductor revolution.

Looking Ahead to 2025

With the budget and plan now approved, Rapidus is gearing up for an exciting year ahead. The pilot line is set to kick off in April, using the manufacturing equipment already installed in the front-end process area. They’re aiming to develop prototype 2 nm Gate-All-Around (GAA) transistors on 300 mm wafers, which is no small feat. Plus, they’ll be releasing a Process Design Kit (PDK) for early customers, making it easier for them to start prototyping.

As for the back-end processes, Rapidus will begin installing manufacturing equipment at RCS in April. This site will focus on developing a pilot line to refine mass production techniques and tackle various advanced processes, including Redistribution Layer (RDL) interposer technology and 3D packaging techniques.

Words from the Top

Dr. Atsuyoshi Koike, the representative director and CEO of Rapidus Corporation, expressed his enthusiasm about the progress: “The construction of the IIM manufacturing facility at Rapidus has progressed smoothly, and by the end of last fiscal year, we had completed the installation of the semiconductor manufacturing equipment necessary for the start of pilot operations. We would like to take this opportunity to express our sincere gratitude to the Ministry of Economy, Trade and Industry (METI), NEDO, Hokkaido, Chitose City, and all others for their generous cooperation. With the approval of the NEDO project plan and budget, we will start up the pilot line in April, which will steadily lead to the start of mass production targeted for 2027.”

In a world that’s rapidly evolving, Rapidus is positioning itself as a key player in the semiconductor landscape. With these developments, we can expect some exciting innovations coming our way in the near future!

Background Information

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About IBM:

IBM, or International Business Machines Corporation, is a globally American multinational technology company with a storied history dating back to its founding in 1911. Over the decades, IBM has consistently been at the forefront of innovation in the field of information technology. The company is known for its pioneering work in computer hardware, software, and services, with breakthroughs like the IBM System/360 and the invention of the relational database.

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Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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EUV: Extreme Ultraviolet Lithography (EUV or EUVL) is an advanced semiconductor manufacturing technique that employs extremely short wavelengths of light in the extreme ultraviolet spectrum to create intricate patterns on silicon wafers. Utilizing a wavelength around 13.5 nanometers, significantly shorter than traditional lithography methods, EUVL enables the production of smaller and more densely packed integrated circuits, enhancing the performance and efficiency of modern microprocessors and memory chips.

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