STMicroelectronics is launching next-generation optical interconnect technology to boost performance and energy efficiency in datacenters and AI clusters, with plans for 800 Gbps and 1.6 Tbps solutions and a partnership with AWS.
- STMicroelectronics is launching next-generation technologies to boost performance in optical interconnects for datacenters and AI clusters.
- Their silicon photonics technology allows for the integration of complex components into a single chip, simplifying design and enhancing performance.
- Their collaboration with AWS aims to facilitate interconnections across various workloads, making it a game-changer for the industry.
STMicroelectronics introduces Next-Gen Optical Interconnect Tech
In a world where the demand for AI computing is skyrocketing, STMicroelectronics is stepping up to the plate with some exciting news. The global semiconductor powerhouse is set to launch its next generation of proprietary technologies aimed at boosting performance in optical interconnects for datacenters and AI clusters. With the rapid growth of AI, we’re witnessing some serious challenges in terms of performance and energy efficiency. STMicroelectronics is on a mission to help hyperscalers and leading optical module providers tackle these challenges head-on.
The Heart of Datacenter Connectivity
At the core of any datacenter are thousands—sometimes even hundreds of thousands—of optical transceivers. These little workhorses are crucial as they convert optical signals into electrical ones and back again, facilitating seamless data flow between graphics processing units (GPUs), switches, and storage. Imagine the chaos that would ensue if these connections faltered! That’s where ST’s silicon photonics (SiPho) technology comes into play. It allows for the integration of complex components into a single chip, simplifying design and enhancing performance. Meanwhile, their next-gen BiCMOS technology promises ultra-high-speed and low-power optical connectivity, essential for keeping pace with the relentless growth of AI.
A Game-Changing Collaboration
Remi El-Ouazzane, President of Microcontrollers, Digital ICs, and RF Products Group at STMicroelectronics, emphasized the urgency of these advancements. “AI demand is accelerating the adoption of high-speed communication technology within the datacenter ecosystem. This is the perfect moment for ST to roll out our new power-efficient silicon photonics technology, paired with an advanced generation of BiCMOS.” By mid-2025, we can expect to see 800 Gbps and 1.6 Tbps solutions hitting the market, designed specifically for hyperscalers.
What’s even more intriguing? Both of these technologies will be manufactured on 300 mm processes in Europe, ensuring that customers have a reliable, independent supply chain for their optical module development strategies. This is just the beginning for ST’s Photonic Integrated Circuit (PIC) product family, and they’re aiming to become a key player in the silicon photonics and BiCMOS wafer market for datacenters and AI clusters.
AWS Joins the Party
But STMicroelectronics isn’t going it alone. They’ve teamed up with none other than AWS to develop a new silicon photonics technology called PIC100. Nafea Bshara, Vice President and Distinguished Engineer at Amazon Web Services, expressed excitement about the collaboration: “We are enthusiastic about the potential innovations this will unlock for SiPho.” This partnership aims to facilitate interconnections across various workloads, including AI, making it a game-changer for the industry.
A Booming Market Ahead
The market for pluggable optics in datacenters is on the rise, projected to reach a whopping $7 billion in 2024. Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting, notes that this market is expected to grow at an impressive compound annual growth rate (CAGR) of 23% from 2025 to 2030, potentially exceeding $24 billion by the end of that period. What’s more, the market share for transceivers based on silicon photonics modulators is set to soar from 30% in 2024 to an eye-popping 60% by 2030.
A Unique Silicon Platform
ST’s SiPho technology, when combined with their BiCMOS technology, creates a unique 300 mm silicon platform tailored for the optical market. Both technologies are currently in the industrialization phase and will be manufactured at ST’s facility in Crolles, France. This is a significant step forward in ensuring that the optical market has the robust, high-performance solutions it needs to keep up with the demands of modern computing.
As we look ahead, it’s clear that STMicroelectronics is not just keeping pace with the rapid evolution of AI and datacenter technology—they’re helping to shape its future. With innovative partnerships and technologies on the horizon, the industry is in for an exhilarating ride.

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