Open Compute Project and JEDEC Unveil Collaborative Chiplet Design Kits

A New Era for chiplet Design

Today, something exciting is happening in the world of semiconductors. The Open Compute Project Foundation (OCP) and the JEDEC Solid State Technology Association have teamed up to unveil new Chiplet Design Kits. These kits are designed for use with modern Electronic Design Automation (EDA) tools and cover everything from assembly to materials and testing. This collaboration is a significant step forward in the OCP’s Open Chiplet Economy Project, and it’s all about making chip design more accessible and efficient.

So, what does this mean for the tech landscape? Well, by integrating these design kits into the Global Worldwide Standard JEDEC JEP30: Part Model Guidelines, OCP and JEDEC are paving the way for a more standardized approach to Chiplet design. This is crucial because it allows Chiplet builders to provide a consistent part description to their customers, making the whole process smoother and more automated. Imagine being able to design a System-in-Package (SiP) with ease—sounds like a game-changer, right?

The Power of Collaboration

According to industry experts like James Wong from Palo Alto Electron and Michael Durkan, Chair of the JEDEC JEP30 Task Group, these new design kits are all about fostering innovation. They emphasize collaboration and openness, which are essential for the rapid adoption of new technologies in the semiconductor industry. By streamlining design workflows and reducing the need for manual interventions, these kits significantly enhance design efficiency and scalability.

The Assembly and Substrate Design Kits are particularly noteworthy. They enable the integration of diverse chiplets by establishing standardized rules for key design elements—think geometries, layers, and interconnects. Meanwhile, the Material Design Kit offers a comprehensive framework for assessing material properties crucial for SiP, focusing on aspects like dielectric constants and thermal conductivity. And let’s not overlook the Test Design Kit, which standardizes the testing process for Chiplet integration, ensuring that everything from planning to manufacturing is as seamless as possible.

Why Chiplets Matter

Chiplets have quickly become the go-to solution for developing chips at nodes. They allow companies to improve SiP performance while keeping costs down, primarily because large firms can manage the entire chip development cycle in-house. But here’s the catch: to create a truly open environment where designers can easily incorporate third-party Chiplets, we need an open marketplace. That’s where the OCP Chiplet Marketplace comes into play.

Cliff Grossner, Ph.D., Chief Innovation Officer at the Open Compute Project Foundation, emphasizes that this marketplace will serve as a front door to a catalog of standalone Chiplets, new standards, tools, and best practices. It’s about creating a vibrant ecosystem where innovation can thrive.

Looking Ahead: The Future of Chiplet Standardization

The schemas included in the Assembly, Materials, and Test design kits are designed to scale efficiently, accommodating a large number of Chiplet interconnection points while keeping everything manageable. Security is also a top priority, with all schema files digitally signed to prevent corruption during the sharing process between buyers and sellers.

There’s still a lot of room for growth in standardization efforts. John Kelly, President of JEDEC, points out that combining JEDEC’s expertise in global standards with OCP’s focus on system-level devices can drive emerging technologies and markets forward. This collaboration is just the beginning.

As we look to the future, it’s clear that the silicon supply chain is on the brink of a transformation. According to Tom Hackenberg, Principal Analyst in Computing & Software at Yole Group, the next wave of innovation will require a rethink of how we approach chip design. Unlike the current model, where most silicon design happens in-house, the future will involve separate organizations handling packaging, testing, and verification.

So, are we ready for this new chapter in chip design? The collaboration between OCP and JEDEC is a promising step towards a more open and efficient Chiplet ecosystem, and it’s going to be fascinating to see where it leads us.

Background Information

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About JEDEC:

JEDEC is the global leader in the development of standards for the microelectronics industry. It was founded in 1958 as the Joint Electron Device Engineering Council to develop standards for the microelectronics industry. The organization's headquarters is located in Arlington, Virginia, United States. JEDEC sets standards for a wide range of technologies, including semiconductors, memory devices, integrated circuits, and more. Its standards are widely adopted and utilized throughout the industry to ensure compatibility and interoperability among various electronic devices and components.

  

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Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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EDA: EDA stands for Electronic Design Automation, and it refers to a category of software tools and solutions used in the design and development of electronic systems and integrated circuits. EDA tools assist engineers and designers in creating complex electronic designs, from individual components to entire systems, by automating various aspects of the design process. These tools encompass a wide range of functionalities, including schematic capture, simulation, layout design, verification, and testing.

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Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.

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