Morse Micro introduces its second-generation MM8108 Wi-Fi HaLow chip, boasting improved performance and power efficiency, along with a USB dongle reference design, to revolutionize the IoT market.
- Impressive data rates of up to 43.33 Mbps
- Equipped with a robust 26dBm power amplifier and low-noise amplifier for top-notch performance
- Streamlines integration process with USB, SDIO, and SPI host integration
Morse Micro introduces Next-Gen Wi-Fi HaLow Chip
Exciting news for tech enthusiasts and IoT developers alike! Morse Micro, a trailblazer in the world of Wi-Fi HaLow chips, has just announced the launch of its highly anticipated second-generation MM8108 System-on-Chip (SoC). This new chip builds on the success of its predecessor, the MM6108, by delivering enhanced performance across the board—think improved range, throughput, and power efficiency, all while making it easier and more cost-effective to roll out the next wave of Wi-Fi HaLow-enabled devices.
So, what makes the MM8108 stand out? For starters, it boasts impressive data rates of up to 43.33 Mbps, thanks to its sub-GHz 256-QAM modulation at an 8 MHz bandwidth. This means it’s not just a chip; it’s a versatile solution designed for various applications, from agriculture and mining to smart homes and urban environments. Imagine deploying solar-powered Wi-Fi HaLow cameras that can stream high-quality video without the constant worry of battery life—sounds pretty great, right?
Power Meets Efficiency
Morse Micro’s latest offering doesn’t just focus on speed; it also emphasizes power efficiency. The MM8108 is equipped with a robust 26dBm power amplifier (PA) and a low-noise amplifier (LNA), ensuring top-notch performance while meeting global regulatory standards without the need for external filters. This translates to longer battery life for your devices, making it a game-changer for IoT applications that require constant connectivity.
Andrew Terry, co-founder and CTO of Morse Micro, puts it succinctly: “Once again, our engineering team has focused on creating the smallest, fastest, and lowest power Wi-Fi HaLow chip in the market.” With features like host offloading and integrated amplifiers, the MM8108 is designed to simplify the development of long-range, low-power IoT applications. But what does this mean for you? It means you can expect practical solutions that meet the evolving demands of a connected world.
Key Features That Impress
Let’s break down some of the standout features of the MM8108:
–
World-first 256-QAM (MCS9) operation
: This innovation improves spectrum efficiency, reducing interference in crowded environments and enabling those impressive data rates.–
USB, SDIO, and SPI host integration
: This feature streamlines the integration process, making it easier for developers to get up and running with both new and existing network infrastructures.–
Integrated PA with unmatched transmit efficiency
: With a high transmit output power of 26dBm and only 325mA current draw from a 3.3 V source, this chip is all about maximizing performance while minimizing power consumption.–
Class-leading Rx and Tx performance
: It allows for the longest reach and fastest connections, making it suitable for everything from AI-enabled IoT devices to streaming multiple 4K cameras in real time.–
Enhanced security
: With support for next-gen WPA3 and robust encryption, your connections will be safer than ever.–
Scalable design
: The compact 5 x 5 mm BGA package means you won’t have to compromise on space or cost when integrating this technology into your products.A New Era with the MM8108-RD09 USB Dongle
But that’s not all! Alongside the MM8108, Morse Micro is also rolling out the MM8108-RD09 USB dongle reference design. This nifty gadget makes it a breeze to upgrade existing Wi-Fi 4/5/6/6E/7 networks to support Wi-Fi HaLow. Imagine being able to easily integrate this technology into your current setup—how convenient is that?
The dongle features a top-notch antenna for optimal performance and is fully compliant with IEEE 802.11ah specifications. Plus, it comes bundled with a Raspberry Pi 4B, power supply, and antenna as part of the complete Wi-Fi HaLow evaluation kit (the MM8108-EKH19). This kit is perfect for developers keen on testing and integrating the MM8108 into their platforms.
Transforming the Market
Michael De Nil, co-founder and CEO of Morse Micro, emphasizes the significance of the MM8108-EKH19, stating, “It’s more than just a Wi-Fi HaLow evaluation platform – it’s an enabler of market transformation.” With the integration process simplified, businesses can easily adopt Wi-Fi HaLow, paving the way for new opportunities in IoT and beyond.
The MM8108 SoC, along with the MM8108-RD09 and MM8108-EKH19, is now available for sampling and evaluation. If you’re interested in learning more, don’t hesitate to reach out to your Morse Micro representative.
About Morse Micro
For those who might not be familiar, Morse Micro is a leading Wi-Fi HaLow fabless semiconductor company based in Sydney, with a global presence. They’re not just another tech company; they’re at the forefront of next-gen IoT wireless connectivity solutions. With the fastest, smallest, and most efficient Wi-Fi HaLow chip on the market, Morse Micro is set to redefine what’s possible in the world of connected devices. Curious to learn more? Check them out at www.morsemicro.com.
In a world where connectivity is king, Morse Micro is leading the charge into a future where everything is seamlessly connected—are you ready to join the revolution?
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Technology Explained
SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.
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