Eliyan Unveils 64Gbps Chiplet Interconnect PHY Built on Advanced 3nm Technology

Eliyan Corporation's NuLink-2.0 is a game-changing chiplet interconnect with impressive performance, compatibility, and adaptability, setting a new standard for multi-die architectures and signaling the industry's readiness for future challenges.

64 Gbps per bump, the highest performance currently available for die-to-die PHY solutions in multi-die architectures
Compatibility with the UCIe standard, allowing for communication between chiplets from different manufacturers
Low power consumption, making it a perfect fit for custom High Bandwidth Memory (HBM4) base dies

Eliyan Corporation introduces NuLink-2.0: A Game-Changer for chiplet Interconnects

In the fast-paced world of semiconductors, where every nanometer counts, Eliyan Corporation has just thrown down the gauntlet with its latest innovation: the NuLink-2.0 PHY. This isn’t just another chip in the ever-growing landscape of silicon; it’s a bold leap forward, promising to redefine how we think about chiplet interconnects.

For those who might not be familiar, chiplets are essentially smaller chips that can be combined to create more complex processors. Think of them like Lego blocks—each one has its own function, but when you snap them together, they can build something far more powerful. Eliyan’s new chiplet interconnect is manufactured using a 3 nm process, which is the latest in chip technology and allows for more transistors to be packed into a smaller space.

So, what’s the big deal about the NuLink-2.0? For starters, it boasts a staggering 64 Gbps per bump—yes, that’s the highest performance currently available for die-to-die PHY solutions in multi-die architectures. If you’re scratching your head at what “die-to-die” means, it’s essentially the communication link between different chiplets on a single package. This is crucial for modern computing, especially as we push the boundaries of artificial intelligence and high-performance computing (HPC).

What’s really interesting here is Eliyan’s compatibility with the UCIe standard, which stands for Universal Chiplet Interconnect Express. This standard is designed to facilitate communication between chiplets from different manufacturers, and Eliyan’s achievement of doubling the bandwidth while keeping power consumption low is no small feat. It’s like finding a way to fit more people into a subway car without making it any more crowded—everyone gets to their destination faster and with less hassle.

The NuLink-2.0 isn’t just a one-trick pony, either. It introduces the Universal Memory Interconnect (UMI), a technology that enhances the efficiency of data transfer between chiplets and memory. Imagine trying to fill a bathtub with a garden hose; it takes forever. Now, picture using a fire hose instead. That’s the kind of efficiency UMI promises, improving Die-to-Memory bandwidth by more than double. It’s currently being finalized with the Open Compute Project (OCP), which is a collaborative community focused on open-source hardware.

One of the standout features of the NuLink-2.0 is its impressive adaptability to different packaging technologies. It can fit under bump pitches as tight as 45-55 micrometers in advanced packaging, while still performing optimally in standard setups. This flexibility opens the door for a wider range of applications, from gaming to aerospace, where reliability is non-negotiable.

Eliyan’s CEO, Ramin Farjadrad, emphasized the broader implications of this milestone: “This sets a new standard in performance and total cost of ownership for implementing a wide range of multi-die use cases.” It’s a statement that resonates, especially as industries look to optimize their designs for cost and complexity.

But let’s talk about power consumption for a moment. In a world where energy efficiency is becoming increasingly critical, the NuLink-2.0 shines. Its low power requirements make it a perfect fit for custom High Bandwidth Memory (HBM4) base dies, which are essential for the next generation of AI systems. If you’ve ever had your smartphone die on you mid-call, you’ll appreciate the importance of power efficiency in tech.

As we stand on the cusp of what could be a semiconductor renaissance, Eliyan’s NuLink-2.0 is not just a technical achievement; it’s a signal that the industry is ready to tackle the challenges of tomorrow. With its ability to scale chiplet-based designs across various sectors, from gaming to industrial applications, it’s hard not to feel a twinge of excitement about where this technology might lead us.

In the end, it’s not just about the numbers—64 Gbps, 5 Tbps/mm, or even 21 Tbps/mm in advanced packaging. It’s about the potential to reshape industries, to create more efficient systems, and to push the boundaries of what we thought was possible. As we continue to integrate more technology into our lives, innovations like the NuLink-2.0 remind us that the future is not just something we wait for; it’s something we build, one chiplet at a time.

Eliyan introduces 64Gbps Chiplet Interconnect PHY Built on Advanced 3nm Technology

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