Eliyan Unveils 64Gbps Chiplet Interconnect PHY Built on Advanced 3nm Technology

**Eliyan Corporation Unveils NuLink-2.0: A Game-Changer for chiplet Interconnects**

In the fast-paced world of semiconductors, where every nanometer counts, Eliyan Corporation has just thrown down the gauntlet with its latest innovation: the NuLink-2.0 PHY. This isn’t just another chip in the ever-growing landscape of silicon; it’s a bold leap forward, promising to redefine how we think about chiplet interconnects.

For those who might not be familiar, chiplets are essentially smaller chips that can be combined to create more complex processors. Think of them like Lego blocks—each one has its own function, but when you snap them together, they can build something far more powerful. Eliyan’s new chiplet interconnect is manufactured using a cutting-edge 3 nm process, which is the latest in chip technology and allows for more transistors to be packed into a smaller space.

So, what’s the big deal about the NuLink-2.0? For starters, it boasts a staggering 64 Gbps per bump—yes, that’s the highest performance currently available for die-to-die PHY solutions in multi-die architectures. If you’re scratching your head at what “die-to-die” means, it’s essentially the communication link between different chiplets on a single package. This is crucial for modern computing, especially as we push the boundaries of artificial intelligence and high-performance computing (HPC).

What’s really interesting here is Eliyan’s compatibility with the UCIe standard, which stands for Universal Chiplet Interconnect Express. This standard is designed to facilitate communication between chiplets from different manufacturers, and Eliyan’s achievement of doubling the bandwidth while keeping power consumption low is no small feat. It’s like finding a way to fit more people into a subway car without making it any more crowded—everyone gets to their destination faster and with less hassle.

The NuLink-2.0 isn’t just a one-trick pony, either. It introduces the Universal Memory Interconnect (UMI), a technology that enhances the efficiency of data transfer between chiplets and memory. Imagine trying to fill a bathtub with a garden hose; it takes forever. Now, picture using a fire hose instead. That’s the kind of efficiency UMI promises, improving Die-to-Memory bandwidth by more than double. It’s currently being finalized with the Open Compute Project (OCP), which is a collaborative community focused on open-source hardware.

One of the standout features of the NuLink-2.0 is its impressive adaptability to different packaging technologies. It can fit under bump pitches as tight as 45-55 micrometers in advanced packaging, while still performing optimally in standard setups. This flexibility opens the door for a wider range of applications, from gaming to aerospace, where reliability is non-negotiable.

Eliyan’s CEO, Ramin Farjadrad, emphasized the broader implications of this milestone: “This sets a new standard in performance and total cost of ownership for implementing a wide range of multi-die use cases.” It’s a statement that resonates, especially as industries look to optimize their designs for cost and complexity.

But let’s talk about power consumption for a moment. In a world where energy efficiency is becoming increasingly critical, the NuLink-2.0 shines. Its low power requirements make it a perfect fit for custom High Bandwidth Memory (HBM4) base dies, which are essential for the next generation of AI systems. If you’ve ever had your smartphone die on you mid-call, you’ll appreciate the importance of power efficiency in tech.

As we stand on the cusp of what could be a semiconductor renaissance, Eliyan’s NuLink-2.0 is not just a technical achievement; it’s a signal that the industry is ready to tackle the challenges of tomorrow. With its ability to scale chiplet-based designs across various sectors, from gaming to industrial applications, it’s hard not to feel a twinge of excitement about where this technology might lead us.

In the end, it’s not just about the numbers—64 Gbps, 5 Tbps/mm, or even 21 Tbps/mm in advanced packaging. It’s about the potential to reshape industries, to create more efficient systems, and to push the boundaries of what we thought was possible. As we continue to integrate more technology into our lives, innovations like the NuLink-2.0 remind us that the future is not just something we wait for; it’s something we build, one chiplet at a time.

Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.