SK hynix Inks Preliminary Deal with U.S. Govt for Cutting-Edge Packaging Facility in Indiana

SK hynix Inc. has signed a preliminary agreement with the U.S. Department of Commerce for up to $450 million in funding and tax benefits to build a production base for semiconductor packaging in Indiana, with the goal of providing AI memory products and contributing to the development of a more resilient supply chain for the global semiconductor industry.

Access to significant funding and loans from the U.S. Department of Commerce
Potential tax benefits through the Investment Tax Credit program
Creation of jobs and collaboration with local research institutions

In a move that could have a significant impact on the global semiconductor industry, SK hynix Inc. has announced that it has signed a non-binding preliminary memorandum of terms with the U.S. Department of Commerce. The agreement could see the South Korean company receive up to $450 million in proposed direct funding and access to proposed loans of $500 million as part of the CHIPS and Science Act. This funding would be used to build a production base for semiconductor packaging in Indiana.

But that’s not all. SK hynix is also planning to seek a tax benefit equivalent to 25% of the qualified capital expenditures through the Investment Tax Credit program. This could provide a major boost to the company’s investment plans.

SK hynix expressed its gratitude for the support from the U.S. government and assured that it would comply with all the necessary requirements to finalize the proposed funding. The company is determined to proceed with the construction of the Indiana production base as planned, with the goal of providing AI memory products. By doing so, SK hynix hopes to contribute to the development of a more resilient supply chain for the global semiconductor industry.

This latest announcement comes on the heels of SK hynix’s previous commitment in April to invest a whopping $3.87 billion in building a production base for advanced packaging in Indiana. This move is expected to create around 1,000 jobs and foster collaboration with local research institutions, including Purdue University, for semiconductor research and development.

SK hynix CEO Kwak Noh-Jung expressed his enthusiasm for the project, stating, “We deeply appreciate the U.S. Department of Commerce’s support and are excited to collaborate in seeing this transformational project fully realized. We are moving forward with the construction of the Indiana production base, working with the State of Indiana, Purdue University, and our U.S. business partners to ultimately supply leading-edge AI memory products from West Lafayette. We look forward to establishing a new hub for AI technology, creating skilled jobs for Indiana, and helping build a more robust, resilient supply chain for the global semiconductor industry.”

This ambitious project has the potential to not only boost SK hynix’s presence in the U.S. market but also strengthen the country’s semiconductor industry as a whole. With the increasing demand for AI memory products, having a production base in Indiana could be a game-changer. It would not only create jobs and foster collaboration but also contribute to the development of technology.

The signing of the preliminary memorandum of terms is just the beginning of an exciting journey for SK hynix. As the company moves forward with its plans, it will be interesting to see how this investment shapes the future of the semiconductor industry and the role that AI memory products will play in it. With the support of the U.S. government and its partners, SK hynix is well-positioned to make a significant impact and establish itself as a leader in the field.

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Background Information

About SK hynix:

SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.