Cutting-edge Weebit Nano and DB HiTek collaborate on 130nm BCD Process Tape-out ReRAM Module

Weebit Nano Limited, a major player in the world of advanced memory technologies, has joined forces with DB HiTek, a leading semiconductor Foundry, to create a cutting-edge chip that incorporates Weebit’s embedded Resistive Random-Access Memory (ReRAM) module. This collaboration marks a significant milestone in the partnership between the two companies, as they work together to bring Weebit ReRAM to DB HiTek customers.

The demo chips, which have been released for manufacturing, will be used for testing and qualification purposes. They not only showcase the performance and durability of Weebit’s technology but also pave the way for customer production. The goal is to have the technology ready for production by the second quarter of 2025.

Weebit ReRAM is a game-changer when it comes to non-volatile memory (NVM) solutions. It offers a cost-effective and low-power alternative to traditional flash memory, making it ideal for a wide range of applications, including consumer electronics, industrial devices, and the Internet of Things (IoT). One of the key advantages of Weebit ReRAM is its ability to retain data even at high temperatures, making it a reliable choice for demanding environments.

DB HiTek’s 130 nm Bipolar-CMOS-DMOS (BCD) process is the perfect match for Weebit ReRAM. This process is well-suited for analog, mixed-signal, and high-voltage designs, making it a popular choice among designers in various industries. By integrating Weebit ReRAM into the DB HiTek process, customers can enjoy the benefits of a high-density NVM that is easy to integrate and offers superior endurance compared to other technologies.

Coby Hanoch, CEO of Weebit Nano, is thrilled with the progress of the collaboration, stating, “This milestone confirms we are proceeding towards qualification of our ReRAM in DB HiTek’s BCD process on schedule, making the technology available to this leading foundry’s extensive customer base.” Hanoch also mentions that they are already in talks with several DB HiTek customers who are eager to incorporate Weebit ReRAM into their system-on-chip (SoC) designs. One exciting area of interest is smart power management integrated circuits (PMICs), where the integration of PMIC with the microcontroller (MCU) on a single die can lead to significant advantages in terms of performance, security, power efficiency, and cost savings.

Ki-Seog Cho, CEO of DB HiTek, echoes Hanoch’s sentiments, stating, “Many of our customers, especially those with power management and high-voltage designs, are looking to gain the advantages of embedded ReRAM.” Cho emphasizes that Weebit ReRAM will provide DB HiTek customers with a low-power, cost-effective, and high-density NVM solution. By transitioning from a two-chip setup to a single-die solution, customers can reduce complexity, save on costs, and improve power efficiency.

Once qualified, Weebit’s memory module will be added to DB HiTek’s BCD 130 nm Process Design Kit (PDK), giving customers the option to use standard modules or customize them according to their specific needs. The demonstration chip itself features a 1 Mb ReRAM module, which can be scaled to higher densities if required. This fully-integrated module includes all the necessary control logic, smart algorithms, decoders, iOS (Input/Output communication elements), and error correcting code (ECC). It’s a comprehensive solution that caters to the needs of embedded applications, complete with the Weebit ReRAM module, a RISC-V MCU, SRAM, peripherals, and system interfaces, such as SPI, UART, JTAG, and GPIO.

The collaboration between Weebit Nano and DB HiTek is an exciting development in the world of advanced memory technologies. With Weebit ReRAM poised to revolutionize the semiconductor industry, we can expect to see more innovative and efficient memory solutions in the near future. The possibilities are endless, and the benefits for customers are undeniable. It’s an exciting time to be in the tech industry, and we can’t wait to see what the future holds.

Technology Explained

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Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).

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SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.