Micron Technology Introduces MRDIMMs Enhancing Memory Capacities for Server Scaling

Micron Technology, Inc. has announced the release of their multiplexed rank dual inline memory modules (MRDIMMs), which offer higher bandwidth, larger capacity, and improved performance for memory-intensive workloads, making them ideal for virtualized multi-tenant, high-performance computing, and AI data center applications.

Offers the highest bandwidth, largest capacity, lowest latency, and improved performance per watt compared to current TSV RDIMMs
Compatible with Intel Xeon 6 processors and provides the much-needed bandwidth and capacity for AI inference and HPC applications
Supports a wide range of capacities and features an improved thermal design for more efficient cooling and optimized total system task energy

Micron Technology, Inc. has just made an exciting announcement that is sure to pique the interest of tech enthusiasts and data center operators alike. They are now sampling their multiplexed rank dual inline memory module (MRDIMMs), which promises to revolutionize memory-intensive workloads and maximize the value of compute infrastructure.

So, what exactly are MRDIMMs and why should we care? Well, for starters, these innovative memory modules outperform current TSV RDIMMs by offering the highest bandwidth, largest capacity, lowest Latency, and improved performance per watt. This means that they are perfectly suited for memory-intensive virtualized multi-tenant, high-performance computing (HPC), and AI data center workloads.

The MRDIMMs are the first generation in Micron’s MRDIMM family and are compatible with Intel Xeon 6 processors. According to Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group, these memory modules deliver the much-needed bandwidth and capacity at lower latency to scale AI inference and HPC applications on next-generation server platforms. In other words, they provide the power and performance required to handle the demanding tasks of modern computing.

One of the key advantages of MRDIMMs over RDIMMs is their ability to offer up to a 39% increase in effective memory bandwidth. This means that data can be transferred faster and more efficiently, resulting in improved overall system performance. Additionally, MRDIMMs boast greater than 15% better bus efficiency and up to 40% latency improvements compared to RDIMMs. These enhancements make a significant difference when it comes to handling memory-intensive workloads.

In terms of capacity, MRDIMMs support a wide range from 32 GB to 256 GB in both standard and tall form factors (TFF). This makes them suitable for high-performance 1U and 2U servers. The TFF modules also feature an improved thermal design that reduces DRAM temperatures by up to 20 degrees Celsius at the same power and airflow. This not only enables more efficient cooling capabilities in data centers but also optimizes total system task energy for memory-intensive workloads.

What’s truly impressive is that Micron’s industry-leading memory design and process technology allows 256 GB TFF MRDIMMs to have the same power envelope as 128 GB TFF MRDIMMs using 16 Gb die. This means that a 256 GB TFF MRDIMM can provide a 35% improvement in performance over similar-capacity TSV RDIMMs at the maximum data rate. These advancements are a game-changer for data centers looking to drive unprecedented total cost of ownership (TCO) benefits.

Matt Langman, vice president and general manager of Datacenter Product Management, Intel Xeon 6 at Intel, highlights the seamless compatibility of MRDIMMs with existing Xeon 6 CPU platforms. This gives customers the flexibility and choice they need when it comes to higher bandwidth, lower latencies, and capacity points for various workloads, including HPC and AI. The collaboration between Micron and Intel ensures that customers will have access to a broad portfolio of MRDIMMs ranging from 32 GB to 256 GB densities and in standard and tall form factors.

Lenovo, a leading technology company, is also excited about the potential of MRDIMMs. Scott Tease, vice president and general manager of AI and High-Performance Computing at Lenovo, believes that these memory modules will help close the bandwidth gap for memory-intensive workloads like AI inference and AI retraining. With the ever-increasing number of cores in processors and GPUs, the demand for memory bandwidth has grown exponentially. Micron’s MRDIMMs aim to address this challenge and deliver balanced system performance.

If you’re eager to get your hands on these memory modules, you’ll be pleased to know that Micron MRDIMMs are available now for sampling and will be shipping in volume in the second half of calendar year 2024. And the good news doesn’t stop there. Subsequent generations of MRDIMMs are expected to deliver up to a whopping 45% better memory bandwidth per channel over similar-generation RDIMMs. This means that the future looks bright for memory-intensive workloads.

In conclusion, Micron’s MRDIMMs are set to revolutionize the way we handle memory-intensive tasks in data centers. With their impressive performance, capacity, and efficiency improvements, these memory modules are a game-changer for AI, HPC, and other demanding workloads. So, if you’re in the market for memory technology, keep an eye out for Micron’s MRDIMMs and get ready to take your compute infrastructure to new heights.

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Background Information

About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.

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About Lenovo:

Lenovo, formerly known as "Legend Holdings," is a important global technology company that offers an extensive portfolio of computers, smartphones, servers, and electronic devices. Notably, Lenovo acquired IBM's personal computer division, including the ThinkPad line of laptops, in 2005. With a strong presence in laptops and PCs, Lenovo's products cater to a wide range of consumer and business needs. Committed to innovation and quality, Lenovo delivers reliable and high-performance solutions, making it a significant player in the tech industry.

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About Micron Technology:

Micron Technology, headquartered in Boise, Idaho, is a global leader in innovative memory and storage solutions. Founded in 1978 by Ward Parkinson, Joe Parkinson, Dennis Wilson, and Doug Pitman, Micron has played a pivotal role in advancing semiconductor technology. The company produces dynamic random-access memory (DRAM), flash memory, and USB flash drives. Micron’s products cater to various applications, including AI, automotive, mobile devices, data centers, and client PCs. Their commitment to innovation and memory technology has positioned them as a key player in the industry.

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Technology Explained

CPU: The Central Processing Unit (CPU) is the brain of a computer, responsible for executing instructions and performing calculations. It is the most important component of a computer system, as it is responsible for controlling all other components. CPUs are used in a wide range of applications, from desktop computers to mobile devices, gaming consoles, and even supercomputers. CPUs are used to process data, execute instructions, and control the flow of information within a computer system. They are also used to control the input and output of data, as well as to store and retrieve data from memory. CPUs are essential for the functioning of any computer system, and their applications in the computer industry are vast.

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HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.

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Latency: Technology latency is the time it takes for a computer system to respond to a request. It is an important factor in the performance of computer systems, as it affects the speed and efficiency of data processing. In the computer industry, latency is a major factor in the performance of computer networks, storage systems, and other computer systems. Low latency is essential for applications that require fast response times, such as online gaming, streaming media, and real-time data processing. High latency can cause delays in data processing, resulting in slow response times and poor performance. To reduce latency, computer systems use various techniques such as caching, load balancing, and parallel processing. By reducing latency, computer systems can provide faster response times and improved performance.

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Xeon: The Intel Xeon processor is a powerful and reliable processor used in many computer systems. It is a multi-core processor that is designed to handle multiple tasks simultaneously. It is used in servers, workstations, and high-end desktop computers. It is also used in many embedded systems, such as routers and switches. The Xeon processor is known for its high performance and scalability, making it a popular choice for many computer applications. It is also used in many cloud computing applications, as it is capable of handling large amounts of data and providing high levels of performance. The Xeon processor is also used in many scientific and engineering applications, as it is capable of handling complex calculations and simulations.