Cutting-Edge Bump Pitch Transformers Set to Transform Advanced 2.5D IC Packaging

Dr. Larry Zu predicts that the latest Bump Pitch Transformer (BPT) designs will revolutionize advanced packaging, democratizing the 2.5D era and accelerating the adoption of AI for lower-cost applications.

The Bump Pitch Transformer (BPT) designs will revolutionize the world of advanced packaging, meeting the skyrocketing demand for AI innovation.
The Fan-Out Chip-on-Substrate with Silicon Bridge (FoCoS-B) technology democratizes the 2.5D era by replacing expensive silicon TSV interposers with more cost-effective re-distribution layers (RDL).
Sarcina has a track record of success in the 2.5D space, with several customer devices entering production over the years.

In a recent address at the Design Automation Conference, Dr. Larry Zu, the Founder and CEO of Sarcina Technology, shared his predictions on how the latest Bump Pitch Transformer (BPT) designs will revolutionize the world of advanced packaging. According to Dr. Zu, these new BPT technologies will accelerate the adoption of 2.5D IC advanced packaging, meeting the skyrocketing demand for AI innovation. It’s an exciting time for the industry, as new opportunities for artificial intelligence computing are on the horizon.

One of the advancements in BPT technology is the Fan-Out Chip-on-Substrate with Silicon Bridge (FoCoS-B). This new packaging technology democratizes the 2.5D era by replacing expensive silicon TSV interposers with more cost-effective re-distribution layers (RDL). This means that homogenous and heterogenous chiplet integration targeting high-performance computing (HPC) devices for AI, data centers, microprocessors, and networking applications can be achieved more efficiently.

Traditionally, advanced 2.5D packaging uses substrates to adjust the microbump pitch of an IC to match the package’s bump pitch. However, these substrates are not only expensive but also in short supply. Additionally, designing these substrates is a complex process that comes with lead-time and cost challenges. The FoCoS-B technology solves these issues by utilizing a Wafer Fan-out RDL technology that has a lower cost and shorter lead time. This breakthrough enables system designers to optimize AI for new lower-cost applications.

Sarcina is currently working with companies on two derivatives of the Bump Pitch Transformer for various applications. Their services include BPT interposer design, O/S test pattern insertion, fabrication & BPT wafer sort, as well as package substrate design, PI/SI + thermal system simulation, and substrate fabrication. They offer a complete WIPO (wafer in, package out) engagement that covers package assembly, final testing, and production services.

Sarcina has a track record of success in the 2.5D space, with several customer devices entering production over the years. One notable example is a large 47.5 mm x 47.5 mm device with an ASIC and two high-bandwidth memory chiplets HBMs on a silicon interposer and 12 substrate layers. This impressive IC ran at 320 Watts, thanks to 32 lanes of 25 Gigabits per second (Gbps) SerDes and 16 lanes of 16 Gbps PCIe-4 interface IP. However, Dr. Zu emphasizes that this is just the tip of the iceberg. The industry is poised for even greater advancements once the latest Bump Pitch Transformer technologies are widely adopted.

It’s clear that the future of advanced packaging is bright, thanks to innovations like Bump Pitch Transformer. With the potential to accelerate the growth of 2.5D semiconductor packages and meet the ever-increasing demand for AI-driven computing capabilities, we can expect exciting developments in the field of artificial intelligence. So, buckle up and get ready for a new era of AI innovation!

Bump Pitch Transformers Set to Transform Advanced 2.5D IC Packaging

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Technology Explained

chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

HPC: HPC, or High Performance Computing, is a type of technology that allows computers to perform complex calculations and process large amounts of data at incredibly high speeds. This is achieved through the use of specialized hardware and software, such as supercomputers and parallel processing techniques. In the computer industry, HPC has a wide range of applications, from weather forecasting and scientific research to financial modeling and artificial intelligence. It enables researchers and businesses to tackle complex problems and analyze vast amounts of data in a fraction of the time it would take with traditional computing methods. HPC has revolutionized the way we approach data analysis and has opened up new possibilities for innovation and discovery in various fields.

PCIe: PCIe (Peripheral Component Interconnect Express) is a high-speed serial computer expansion bus standard for connecting components such as graphics cards, sound cards, and network cards to a motherboard. It is the most widely used interface in the computer industry today, and is used in both desktop and laptop computers. PCIe is capable of providing up to 16 times the bandwidth of the older PCI standard, allowing for faster data transfer speeds and improved performance. It is also used in a variety of other applications, such as storage, networking, and communications. PCIe is an essential component of modern computing, and its applications are only expected to grow in the future.

Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.