SK hynix CEO reveals high demand for HBM in 2025 production.

SK hynix introduces vision and strategy for AI era, highlighting investment plans for facilities and leadership in memory technologies, including HBM and DRAM, to meet increasing demand for AI applications.

SK hynix is a leading semiconductor manufacturer with a strong track record of success.
The company is investing in advanced facilities and technologies to meet the growing demand for AI memory products.
SK hynix is committed to contributing to the domestic economy and advancing Korea's position as an AI memory powerhouse.

SK hynix, a leading semiconductor manufacturer, recently held a press conference to unveil its vision and strategy for the AI era. The event, hosted by CEO Kwak Noh-Jung, provided insights into the company’s investment plans for its facilities in Korea and the United States.

During the conference, key executives, including Justin Kim, Head of AI Infra, and Kim Yeongsik, Head of Manufacturing Technology, shared their plans and discussed the company’s core technologies.

SK hynix highlighted the fast expansion of AI technology into various on-device applications, such as smartphones, PCs, and automobiles. The company anticipates a significant increase in demand for ultra-fast, high-capacity, and low-power memory products for AI applications.

The company emphasized its position as a leader in various memory technologies, including High Bandwidth Memory (HBM), TSV-based high-capacity DRAM, and high-performance eSSD. SK hynix aims to provide customized memory solutions to customers through strategic collaborations with global business partners.

In terms of production, SK hynix revealed that the demand for HBM is already exceeding supply. The company plans to provide samples of its industry-leading 12-high HBM3E in May and begin mass production in the third quarter. SK hynix aims to achieve qualitative growth by improving cost competitiveness and profitability through an increase in sales of value-added products.

The company is committed to contributing to the domestic economy and advancing Korea’s position as an AI memory powerhouse. It recognizes the importance of memory in the data-centric AI era and expects a significant rise in the sales ratio of AI memory, particularly HBM and high-capacity DRAM modules.

SK hynix also highlighted its technological leadership in various AI applications, including DRAM and NAND space. The company is mass producing HBM3E and modules with ultra-high capacity and has commercialized the world’s fastest LPDDR5T. Additionally, SK hynix is actively developing next-generation products with improved performance, such as HBM4, HBM4E, LPDDR6, 300 TB SSD, CXL Pooled Memory Solution, and Processing-In-Memory.

Choi Woojin, Head of Package & Test, discussed SK hynix’s core technology for HBM packaging, known as MR-MUF. The company has successfully implemented its Advanced MR-MUF technology, which improves heat dissipation and productivity. SK hynix plans to adopt Advanced MR-MUF for the realization of 16-high HBM4 and is exploring Hybrid Bonding technology.

In addition to its advancements in packaging technology, SK hynix announced plans to build advanced packaging facilities for AI memory in Indiana. The company aims to start mass production of AI products, including next-generation HBM, from its Indiana fab in the second half of 2028. This investment in Indiana aligns with SK hynix’s goal of strengthening collaboration with customers and enhancing competitiveness in the AI space.

Furthermore, SK hynix shared its investment plans for the M15X fab in Cheongju and the Yongin Semiconductor Cluster in Korea. The M15X fab will accommodate various processes for HBM production and is expected to maximize production efficiency. Construction of the M15X fab has already begun and is scheduled for completion in November 2025.

The Yongin Semiconductor Cluster will consist of four fabs and a complex for business partners and infrastructure. The construction of the first fab is set to begin in March 2025, with completion expected in May 2027. SK hynix plans to support domestic business partners by providing a mini fab within the cluster for testing new technologies under practical circumstances.

Overall, SK hynix’s press conference showcased its commitment to driving innovation in the AI era and strengthening Korea’s leadership in the semiconductor industry. The company’s investment plans and focus on advanced memory technologies position it well for the future of AI applications.

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Background Information

About SK hynix:

SK Hynix is a important South Korean semiconductor company known for its innovative contributions to the global technology landscape. Specializing in the production of memory solutions, SK Hynix has played a vital role in shaping the semiconductor industry. With a commitment to research and development, they have continuously pushed the boundaries of memory technology, resulting in products that power various devices and applications.

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Technology Explained

HBM3E: HBM3E is the latest generation of high-bandwidth memory (HBM), a type of DRAM that is designed for artificial intelligence (AI) applications. HBM3E offers faster data transfer rates, higher density, and lower power consumption than previous HBM versions. HBM3E is developed by SK Hynix, a South Korean chipmaker, and is expected to enter mass production in 2024. HBM3E can achieve a speed of 1.15 TB/s and a capacity of 64 GB per stack. HBM3E is suitable for AI systems that require large amounts of data processing, such as deep learning, machine learning, and computer vision.

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NAND: NAND technology is a type of non-volatile memory that is used in many computer applications. It is a type of flash memory that is used to store data in a non-volatile manner, meaning that the data is not lost when the power is turned off. NAND technology is used in many computer applications, such as solid-state drives, USB flash drives, digital cameras, and memory cards. It is also used in many embedded systems, such as cell phones, tablets, and other consumer electronics. NAND technology is a reliable and cost-effective way to store data, making it a popular choice for many computer applications.

Latest Articles about NAND

SSD: A Solid State Drive (SSD) is a modern data storage device that employs flash memory technology to store data electronically. Unlike traditional hard disk drives (HDDs), SSDs have no moving parts, resulting in significantly faster read and write speeds. This leads to quicker boot times, faster application loading, and smoother overall system performance. SSDs are known for their durability, shock resistance, and energy efficiency, making them ideal for laptops, ultrabooks, and other portable devices. They come in various form factors, including 2.5-inch, M.2, and PCIe cards, and are favored for their reliability, quiet operation, and reduced heat generation