Raytheon collaborates with AMD to create Multi-Chip Package technology.

Raytheon, the technology company and an RTX business, has recently secured a significant contract worth $20 million. This contract has been awarded through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium. The purpose of the contract is to develop an advanced multi-chip package that will be utilized in ground, maritime, and airborne sensors.

As part of this contract, Raytheon will collaborate with industry partners, including AMD, to incorporate commercial devices into their microelectronics package. This package will have the remarkable ability to convert radio frequency energy into digital information, offering improved bandwidth and higher data rates. The integration of these state-of-the-art devices will result in new system capabilities that boast enhanced performance, reduced power consumption, and lighter weight.

Colin Whelan, the President of Advanced Technology at Raytheon, expressed his excitement about this collaboration with commercial industry partners. He emphasized the accelerated timescale at which they can incorporate the latest technology into Department of Defense applications. Whelan stated, “Together, we will deliver the first multi-chip package that features the latest in interconnect ability – which will provide new system capabilities to our warfighters.”

The multi-chip package developed under this contract will leverage the latest advancements in industry-standard die-level interconnect ability. This will allow individual chiplets to achieve their maximum performance and unlock new system capabilities in a cost-effective and high-performance manner. Furthermore, the package is designed to be compatible with Raytheon’s scalable sensor processing requirements.

To bring this ambitious project to fruition, chiplets from commercial partners will be seamlessly integrated onto a specially designed and fabricated interposer by Raytheon’s 3D Universal Packaging (3DUP) domestic silicon manufacturing process. The manufacturing process will take place in Lompoc, California, ensuring a localized approach.

The National Security Technology Accelerator will oversee the management of this prestigious award, while the Naval Surface Warfare Center Crane Division in Indiana will administer its execution. This collaboration between Raytheon, industry partners, and government entities promises to deliver advancements in sensor technology, empowering our warfighters with capabilities.

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chiplets: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build a variety of computer systems. Chiplets are designed to be highly efficient and cost-effective, allowing for the creation of powerful and complex systems without the need for large, expensive components. They are also highly customizable, allowing for the creation of systems tailored to specific needs. Chiplets are being used in a variety of applications, from high-end gaming PCs to embedded systems and even supercomputers. They are also being used to create powerful AI systems, allowing for the development of more advanced and intelligent machines. Chiplets are revolutionizing the computer industry, allowing for the creation of powerful and efficient systems at a fraction of the cost.

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