Micron introduces Enhanced UFS 4.0, Setting New Standard for Compactness in Storage


February 27, 2024 by our News Team

Micron Technology delivers an enhanced version of its UFS 4.0 mobile solution, featuring breakthrough firmware features and the world's most compact UFS package, to provide exceptional performance and innovation for flagship smartphones.

  • Breakthrough proprietary firmware features
  • Compact package design for energy-efficient and ultra-slim smartphones
  • Advanced 232-layer 3D NAND and up to 1TB capacity for exceptional performance and innovation


Micron Technology, a leading provider of memory and storage solutions, has announced the delivery of qualification samples for an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution. This new offering boasts breakthrough proprietary firmware features and comes in the world’s most compact UFS package, measuring just 9×13 millimeters (mm). With its advanced 232-layer 3D NAND and up to 1 terabyte (TB) capacity, the UFS 4.0 solution delivers exceptional performance and innovation, enabling faster and more responsive experiences on flagship smartphones.

Micron’s UFS 4.0 solution sets a new standard for data-intensive experiences, providing sequential read speeds of up to 4300 megabytes per second (MBps) and sequential write speeds of up to 4000 MBps – twice the performance of previous generations. These impressive speeds allow users to launch their favorite productivity, creativity, and AI apps with greater speed and efficiency. In fact, large language models in generative AI applications can be loaded 40% faster, resulting in a smoother experience when engaging with AI digital companions.

Mark Montierth, General Manager and Corporate Vice President of Micron’s Mobile Business Unit, expressed his excitement about the latest UFS 4.0 solution, stating, “Micron’s latest UFS 4.0 solution enables world-class storage performance and reduced power in the world’s smallest UFS package. Supercharged with breakthrough firmware advancements to keep smartphones running like new, Micron UFS 4.0 raises the bar for mobile storage with enhanced performance, flexibility, and scalability to accelerate the rollout of generative AI-capable smartphones.”

One of the key highlights of Micron’s UFS 4.0 solution is its compact package design, which paves the way for energy-efficient and ultra-slim smartphones. Since its initial introduction in June last year with an 11×13 mm package, Micron has managed to reduce the footprint of its UFS 4.0 solution even further, now offering the world’s most compact managed NAND package size at 9×13 mm. This reduction in size is particularly beneficial for next-generation foldable and ultra-slim smartphone designs, allowing manufacturers to allocate more space for larger batteries. Coupled with the solution’s 25% increase in power efficiency, users can enjoy extended battery life, even when utilizing power-hungry features such as AI, Augmented Reality, gaming, and multimedia apps.

Micron’s commitment to pushing the boundaries of mobile flash storage is evident in its proprietary firmware innovations. The company has introduced several custom firmware updates, including High-Performance Mode (HPM), One Button Refresh (OBR), and Zoned UFS (ZUFS). HPM optimizes performance by prioritizing critical tasks over background tasks, resulting in a 25% improvement in speed when launching multiple applications. OBR ensures devices continue operating in a like-new state by automatically cleaning and optimizing data, leading to faster read/write performance and snappy app launches. ZUFS allows the host to specify different zones for data storage, maximizing device performance and extending the smartphone lifespan.

Micron’s teams of engineers have developed these innovative firmware features through extensive research and collaboration with customers. By anticipating emerging use cases, running real-world simulations, and working closely with smartphone OEMs, Micron aims to address critical pain points and provide bespoke solutions that enhance user experiences.

Micron is now shipping samples of its upgraded UFS 4.0 in capacities of 256 gigabytes (GB), 512 GB, and 1 TB. These expanded capacities enable flagship smartphones to handle the vast amount of data generated by on-device AI assistants and users’ growing photo libraries, ensuring greater security compared to cloud-based solutions. With all data stored locally, consumers can enjoy always-on access to their personal data and powerful AI features, even in offline or low-service areas.

Micron introduces Enhanced UFS 4.0, Setting New Standard for Compactness in Storage

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Background Information


About Micron Technology: Micron Technology, headquartered in Boise, Idaho, is a global leader in innovative memory and storage solutions. Founded in 1978 by Ward Parkinson, Joe Parkinson, Dennis Wilson, and Doug Pitman, Micron has played a pivotal role in advancing semiconductor technology. The company produces dynamic random-access memory (DRAM), flash memory, and USB flash drives. Micron’s products cater to various applications, including AI, automotive, mobile devices, data centers, and client PCs. Their commitment to innovation and memory technology has positioned them as a key player in the industry.

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Technology Explained


NAND: NAND technology is a type of non-volatile memory that is used in many computer applications. It is a type of flash memory that is used to store data in a non-volatile manner, meaning that the data is not lost when the power is turned off. NAND technology is used in many computer applications, such as solid-state drives, USB flash drives, digital cameras, and memory cards. It is also used in many embedded systems, such as cell phones, tablets, and other consumer electronics. NAND technology is a reliable and cost-effective way to store data, making it a popular choice for many computer applications.





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