Frore Systems introduces AirJet Mini Slim, a Compact Innovation at CES 2024

CES Las Vegas

Frore Systems, the trailblazing developer behind the world’s first Solid-State Active Cooling Chip, made waves at CES 2024 with the unveiling of their latest innovation, the AirJet Mini Slim. This solid-state active cooling chip takes everything that made its predecessor, the AirJet Mini, a standout success and cranks it up a notch. With a slew of new features, a sleeker design, and impressive performance, Frore Systems is pushing the boundaries of thermal management.

One of the standout features of the AirJet Mini Slim is its incredibly thin profile. Measuring at a mere 2.5 mm and weighing only 8 g, this chip sheds an additional 0.3 mm and 1 g from its predecessor’s size while maintaining the same impressive heat removal capabilities. This ultra-thin design opens up a world of possibilities for manufacturers catering to consumers’ demands for high-performance devices that are getting increasingly thinner. From fanless Laptops to professional Tablets, handheld gaming devices to SSD accessories and smartphones, the AirJet Mini Slim is an ideal solution for those seeking enhanced performance in sleeker devices.

Another noteworthy addition to the AirJet Mini Slim is its intelligent self-cleaning feature. Dust accumulation has long been a challenge in the electronics industry, leading to operational risks and decreased performance. However, Frore Systems has tackled this issue head-on by introducing an intelligent self-cleaning function to the AirJet Mini Slim. This feature automatically reverses airflow, clearing any accumulated dust from the AirJet dust filters. By doing so, it ensures that the AirJet maintains peak performance over the long term and keeps the host device running smoothly. What’s even more impressive is that this intelligent self-cleaning feature is backward compatible and also available with the AirJet Mini.

The AirJet Mini Slim also introduces a capability called Thermoception. This innovation allows the chip to independently sense its temperature, enabling it to optimize its performance autonomously. Unlike traditional cooling solutions that rely on temperature sensors in the host device, Thermoception opens up new possibilities for cooling devices that lack integrated CPUs and temperature sensing components. This advancement in thermal management technology is yet another testament to Frore Systems’ commitment to pushing the boundaries of innovation.

Dr. Seshu Madhavapeddy, Founder and CEO of Frore Systems, expressed his excitement about the AirJet Mini Slim, noting that reducing the chip’s thickness by 0.3 mm is a game-changer for devices that require excellent thermal management in increasingly thinner form factors. This innovation will undoubtedly bring much-needed performance improvements to ultra-thin electronic devices like fanless laptops, tablets, and smartphones.

Since its launch in January 2023, Frore Systems’ AirJet line has garnered unprecedented demand for its small yet highly effective active cooling chips. The AirJet Mini Slim, with its new intelligent capabilities, is a mere 2.5 mm thick and weighs just 8 g. It trims down on the thickness and weight of the original AirJet Mini while retaining the same compact footprint of 27.5 mm x 41.5 mm. Like all Frore System products, the AirJet Mini Slim is a scalable solution, allowing for additional heat removal by simply adding more AirJet chips. With each chip capable of removing 5 W of heat, manufacturers can easily integrate multiple chips to achieve higher heat removal capacities.

The compact size and scalability of the AirJet Mini Slim make it a versatile solution for a wide range of devices. From notebooks and mini-PCs to tablets, smartphones, and SSDs, this innovative cooling chip can enhance performance across various industries. Whether it’s in the data center or automotive sector, Frore Systems’ AirJet technology can revolutionize thermal management in devices as diverse as DSLR cameras, WiFi access points, and LED lighting. As the demand for faster, thinner, lighter, silent, and dustproof devices continues to grow, Frore Systems’ AirJet Mini Slim is poised to be at the forefront of the thermal management revolution.

Event Info

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About CES: CES, the Consumer Electronics Show, is an annual event held in Las Vegas, Nevada, organized by the Consumer Technology Association (CTA). With a history dating back to 1967, it has become the world's premier platform for unveiling and exploring the latest innovations in consumer electronics and technology. Drawing exhibitors ranging from industry titans to startups across diverse sectors, including automotive, health and wellness, robotics, gaming, and artificial intelligence, CES transforms Las Vegas into a global tech hub, offering a glimpse into the future of technology through a wide array of showcases, from startup-focused Eureka Park to cutting-edge automotive and health tech exhibitions.

  

Technology Explained

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SSD: A Solid State Drive (SSD) is a modern data storage device that employs flash memory technology to store data electronically. Unlike traditional hard disk drives (HDDs), SSDs have no moving parts, resulting in significantly faster read and write speeds. This leads to quicker boot times, faster application loading, and smoother overall system performance. SSDs are known for their durability, shock resistance, and energy efficiency, making them ideal for laptops, ultrabooks, and other portable devices. They come in various form factors, including 2.5-inch, M.2, and PCIe cards, and are favored for their reliability, quiet operation, and reduced heat generation