Siemens and Intel join forces for cutting-edge semiconductor manufacturing collaboration.

Siemens AG and Intel Corporation have announced a partnership to advance digitalization and sustainability in microelectronics manufacturing, focusing on future manufacturing efforts, factory operations, cybersecurity, and supporting a resilient global industry ecosystem.

The partnership will focus on various areas, including future manufacturing efforts, factory operations, cybersecurity, and supporting a resilient global industry ecosystem.
The memorandum of understanding (MoU) outlines key areas of collaboration, such as optimizing energy management and addressing carbon footprints throughout the value chain.
The partnership also aims to minimize energy use by leveraging advanced modeling techniques to analyze natural resources and environmental footprints.

Siemens AG and Intel Corporation have announced a partnership aimed at advancing digitalization and sustainability in microelectronics manufacturing. The collaboration will focus on various areas, including future manufacturing efforts, factory operations, cybersecurity, and supporting a resilient global industry ecosystem.

Cedrik Neike, CEO of Digital Industries at Siemens AG, emphasized the importance of semiconductors in modern economies and expressed pride in collaborating with Intel to advance semiconductor production. Siemens will bring its IoT-enabled hardware and software, as well as electrical equipment, to the partnership. Neike believes that their joint efforts will contribute to achieving global sustainability goals.

The memorandum of understanding (MoU) outlines key areas of collaboration, such as optimizing energy management and addressing carbon footprints throughout the value chain. One initiative involves exploring the use of “digital twins” of complex manufacturing facilities to standardize solutions and improve efficiency.

The partnership also aims to minimize energy use by leveraging advanced modeling techniques to analyze natural resources and environmental footprints. Intel will work with Siemens to develop product- and supply chain-related modeling solutions that provide insights on emissions. This data-driven approach will help the industry make progress in reducing its collective environmental impact.

Keyvan Esfarjani, executive vice president and chief global operations officer at Intel, highlighted the need for a globally balanced, sustainable, and resilient semiconductor supply chain to meet the growing demand for chips. He expressed excitement about expanding the collaboration with Siemens to explore how automation solutions can enhance efficiency and sustainability in semiconductor infrastructure, facilities, and factory operations.

Sustainable practices across the entire semiconductor life cycle are crucial for meeting the demand for powerful and sustainable chips. The technology industry, along with the global economy, can benefit from leveraging automation and digitalization to reduce computing-related climate impacts. Siemens and Intel, with their combined strengths and expertise, are well-positioned to lead the way in driving positive change in the industry.

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Background Information

About Intel:

Intel Corporation, a global technology leader, is for its semiconductor innovations that power computing and communication devices worldwide. As a pioneer in microprocessor technology, Intel has left an indelible mark on the evolution of computing with its processors that drive everything from PCs to data centers and beyond. With a history of advancements, Intel's relentless pursuit of innovation continues to shape the digital landscape, offering solutions that empower businesses and individuals to achieve new levels of productivity and connectivity.