Exploring Framework Laptop 16’s Liquid Metal Cooling Solution: A Breakthrough Innovation

The Framework Laptop 16 utilizes a liquid metal thermal interface on the CPU, boasting a high thermal conductivity rating of 72 W/mK and multiple levels of containment for safety, resulting in an impressive thermal solution that keeps temperatures under control for optimal performance.

The powerful Ryzen 7040 Series processor allows for sustained high performance.
The combination of a vapor chamber, heatpipes, and fins efficiently dissipates heat.
The use of liquid metal thermal interface provides exceptional thermal conductivity and long-lasting effectiveness.

The Framework Laptop 16 is equipped with the powerful Ryzen 7040 Series processor, capable of running at a sustained 45 W TDP. To ensure optimal performance while keeping temperatures and fan noise in check, we have implemented an impressive thermal solution.

Efficient heat dissipation is crucial, and to achieve this, we have utilized a combination of a vapor chamber, heatpipes, and fins. However, due to slight imperfections in the CPU die and vapor chamber surface, a thermal interface material is necessary to fill in any gaps and prevent the trapping of insulative air.

While traditional computers rely on thermal grease, which contains thermally conductive particles suspended in silicone, we have taken a different approach. The Framework Laptop 16 utilizes a liquid metal thermal interface on the CPU. This liquid metal, composed of indium, tin, and bismuth, undergoes a phase change from solid to liquid at approximately 58 °C as the CPU heats up. This transformation allows it to effectively fill any air gaps and provide exceptional thermal conductivity.

Unlike traditional thermal paste, liquid metal boasts an impressive thermal conductivity rating of 72 W/mK, far surpassing the typical 5-10 W/mK. Furthermore, it does not dry out or pump out over time, ensuring long-lasting effectiveness.

To address concerns regarding the safety of having a highly electrically conductive liquid within a portable device, we have implemented multiple levels of containment within the thermal system. Firstly, during Mainboard assembly, an insulative glue layer is applied using a robotic fixture to cover the small capacitors located next to the CPU dies. Additionally, an etched pattern on the vapor chamber’s surface holds the liquid metal in place through tension. Lastly, a dual foam barrier surrounds the CPU, creating a seal between the processor package and the vapor chamber copper plate, effectively preventing any liquid metal from escaping.

The result of this meticulous design and implementation is an impressive thermal solution that keeps temperatures well under control, ensuring optimal CPU performance. The Framework Laptop 16 delivers a cool and efficient computing experience without compromising on power.

Exploring Framework Laptop 16’s Liquid Metal Cooling Solution: A Breakthrough Innovation

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Technology Explained

CPU: The Central Processing Unit (CPU) is the brain of a computer, responsible for executing instructions and performing calculations. It is the most important component of a computer system, as it is responsible for controlling all other components. CPUs are used in a wide range of applications, from desktop computers to mobile devices, gaming consoles, and even supercomputers. CPUs are used to process data, execute instructions, and control the flow of information within a computer system. They are also used to control the input and output of data, as well as to store and retrieve data from memory. CPUs are essential for the functioning of any computer system, and their applications in the computer industry are vast.