Ansys teams up with TSMC and Microsoft to boost 3D-IC reliability simulation.


November 17, 2023 by our News Team

Ansys, TSMC, and Microsoft have collaborated to develop a joint solution leveraging Ansys Mechanical and Microsoft Azure to analyze and mitigate mechanical stresses in 3D-IC systems, enabling customers to design reliable and high-performance 3D ICs for a range of applications.

  • The collaboration between Ansys, TSMC, and Microsoft provides a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems.
  • The solution leverages Ansys Mechanical, a powerful finite element analysis software that simulates mechanical stresses caused by thermal gradients in 3D-ICs.
  • The software's hybrid parallel solver enables cost-effective computing by utilizing on-demand cloud resources.


Ansys, a leading provider of engineering simulation software, has teamed up with TSMC (Taiwan Semiconductor Manufacturing Company) and Microsoft to develop a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems. This collaboration aims to enhance the functional reliability of advanced designs using TSMC’s 3DFabric advanced packaging technologies.

The solution leverages Ansys Mechanical, a powerful finite element analysis software that simulates mechanical stresses caused by thermal gradients in 3D-ICs. By running efficiently on Microsoft Azure, a cloud computing platform, the solution ensures fast turnaround times for complex 2.5D/3D-IC systems.

One of the key challenges in 3D-IC systems is managing the intense mechanical stresses that arise from temperature variations between components. These stresses can lead to connection failures and reduce the lifespan of the assembly. As semiconductor systems become larger and more complex, it becomes increasingly difficult to analyze them effectively.

Ansys Mechanical, running on Azure’s high-performance computing infrastructure, addresses this challenge by scaling up computationally demanding stress simulations while maintaining accuracy. The software’s hybrid parallel solver enables cost-effective computing by utilizing on-demand cloud resources.

James Chen, Director of TSMC’s 3D IC Integration Division, highlights the importance of accurate analysis results in designing 3D ICs using TSMC’s 3DFabric technologies. The collaboration with Ansys and Microsoft, he says, will benefit designers by providing faster simulations without compromising accuracy, ensuring high-quality 3D IC designs for next-generation applications in AI, HPC, mobile, and networking.

John Lee, Vice President and General Manager of Ansys’ semiconductor, electronics, and optics business unit, emphasizes the value of an open ecosystem approach. By offering best-in-class solutions and cloud-ready solvers, Ansys enables customers and partners to make the most of their design processes.

Merrie Williamson, Corporate Vice President at Microsoft, highlights the optimized cloud solutions developed through collaboration with Ansys. By leveraging Microsoft Azure’s resources and elastic compute capabilities, the joint effort has created a solution flow that harnesses the power of cloud technology.

This collaboration between Ansys, TSMC, and Microsoft represents a significant step forward in addressing the challenges of analyzing and mitigating mechanical stresses in 3D-IC systems. By combining industry-leading simulation software, cloud computing capabilities, and advanced packaging technologies, the joint solution offers customers enhanced confidence in designing reliable and high-performance 3D ICs for a range of applications.

Ansys teams up with TSMC and Microsoft to boost 3D-IC reliability simulation.

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Background Information


About Microsoft: Microsoft, founded by Bill Gates and Paul Allen in 1975 in Redmond, Washington, USA, is a technology giant known for its wide range of software products, including the Windows operating system, Office productivity suite, and cloud services like Azure. Microsoft also manufactures hardware, such as the Surface line of laptops and tablets, Xbox gaming consoles, and accessories.

Microsoft website  Microsoft LinkedIn

About TSMC: TSMC, or Taiwan Semiconductor Manufacturing Company, is a semiconductor foundry based in Taiwan. Established in 1987, TSMC is a important player in the global semiconductor industry, specializing in the manufacturing of semiconductor wafers for a wide range of clients, including technology companies and chip designers. The company is known for its semiconductor fabrication processes and plays a critical role in advancing semiconductor technology worldwide.

TSMC website  TSMC LinkedIn



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