Winbond introduces Revolutionary CUBE Architecture, Empowering Edge AI Devices with Unmatched Potential


September 27, 2023

Winbond Electronics Corporation has introduced CUBE, an innovative technology that enables affordable Edge AI computing in mainstream applications, optimizing memory performance for seamless execution of generative AI on hybrid edge/cloud platforms.

  • Optimizes memory performance for seamless execution of generative AI on hybrid edge/cloud platforms
  • Exceptional power efficiency, delivering less than 1pJ/bit energy consumption for extended operation and optimized energy usage
  • Cost-effectiveness with impressive data rate of up to 2 Gbps and a total of 1K IO


Winbond Electronics Corporation, a important player in the semiconductor memory solutions market, has introduced an innovative technology called customized ultra-bandwidth elements (CUBE) that enables affordable Edge AI computing in mainstream applications. This breakthrough technology optimizes memory performance for seamless execution of generative AI on hybrid edge/cloud platforms.

CUBE enhances the performance of front-end 3D structures like chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on Substrate and fan-out solutions. It is designed to meet the increasing demands of edge AI computing devices and offers compatibility with memory density ranging from 256 Mb to 8 Gb with a single die. Additionally, CUBE can be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

With the introduction of CUBE, Winbond is taking a significant step forward in enabling seamless deployment across various platforms and interfaces. This technology is particularly well-suited for advanced applications such as wearable and edge server devices, surveillance equipment, ADAS, and co-robots.

“The CUBE architecture enables a paradigm shift in AI deployment,” says Winbond. “We believe that the integration of cloud AI and powerful edge AI will define the next phase of AI development. With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimization on powerful Edge AI devices.”

Key features of CUBE include exceptional power efficiency, delivering less than 1pJ/bit energy consumption for extended operation and optimized energy usage. It also offers superior performance with bandwidth capabilities ranging from 32 GB/s to 256 GB/s per die, surpassing industry standards. Furthermore, CUBE comes in a compact size with memory capacities ranging from 256Mb to 8Gb per die, making it seamlessly fit into smaller form factors.

CUBE’s cost-effectiveness is another highlight, with its IO boasting an impressive data rate of up to 2 Gbps and a total of 1K IO. When combined with legacy Foundry processes like 28 nm/22 nm SoC, CUBE delivers ultra-high bandwidth capabilities, equivalent to harnessing the power of multiple LP-DDR4x 4266 Mbps x16 IO bandwidth.

By stacking the SoC (top die without TSV) on top of the CUBE (bottom die with TSV), it becomes possible to reduce the SoC die size and eliminate any TSV penalty area. This not only enhances cost advantages but also contributes to overall efficiency, including the small form factor of Edge AI devices.

“CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, Response Time, and energy efficiency,” added Winbond. “Winbond’s commitment to innovation and collaboration will enable developers and enterprises to drive advancement across various industries.”

Winbond is actively collaborating with partner companies to establish the 3DCaaS platform, leveraging CUBE’s capabilities. By integrating CUBE with existing technologies, Winbond aims to provide solutions that empower businesses to thrive in the era of AI-driven transformation.

Winbond introduces Revolutionary CUBE Architecture, Empowering Edge AI Devices with Unmatched Potential

(Source)

Background Information


About Winbond Electronics Corporation: Winbond Electronics Corporation is a important semiconductor company headquartered in Taiwan. Specializing in memory solutions, Winbond is for producing a wide range of memory ICs (Integrated Circuits) used in various applications, including consumer electronics, automotive, industrial, and communications sectors. With a history dating back to 1987, the company has established itself as a leading provider of Flash memory, DRAM, and other semiconductor products.



Technology Explained


Foundry: A foundry is a dedicated manufacturing facility focused on producing semiconductor components like integrated circuits (ICs) for external clients. These foundries are pivotal in the semiconductor industry, providing diverse manufacturing processes and technologies to create chips based on designs from fabless semiconductor firms or other customers. This setup empowers companies to concentrate on innovative design without needing substantial investments in manufacturing infrastructure. Some well-known foundries include TSMC (Taiwan Semiconductor Manufacturing Company), Samsung Foundry, GlobalFoundries, and UMC (United Microelectronics Corporation).


Response Time: Technology response time is the amount of time it takes for a computer system to respond to a given input from a user. It is a measure of how quickly a computer system can respond to a user’s query or instruction. The lower the response time the better the performance of the system. The response time is an important factor in the performance of different computer systems. In the computer industry, technology response time can be used to measure the efficiency of different computers, meaning that the faster the response time the higher the performance. Technology response time can also be used to compare the performance of different computer systems by measuring how quickly they can respond to a given input.


SoC: A System-on-Chip (SoC) is a highly integrated semiconductor device that encapsulates various electronic components, including processors, memory, input/output interfaces, and often specialized hardware components, all on a single chip. SoCs are designed to provide a complete computing system or subsystem within a single chip package, offering enhanced performance, power efficiency, and compactness. They are commonly used in a wide range of devices, from smartphones and tablets to embedded systems and IoT devices, streamlining hardware complexity and facilitating efficient integration of multiple functions onto a single chip.


Substrate: The technology substrate is a layer of material that provides a foundation for the components of a computer system. It is the foundation upon which the components of a computer system are built. It is usually made of a material such as silicon, which is a semiconductor material. The technology substrate is used to create the circuits and pathways that allow the components of a computer system to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components. The technology substrate is essential for the functioning of a computer system, as it provides the necessary pathways for the components to communicate with each other. It is also used to create the physical structure of the computer system, such as the motherboard, memory, and other components.





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