ITRI Takes the Lead in Global Semiconductor Collaboration, Pioneering Pilot Production Solutions for Heterogeneous Integration

The emergence of Generative AI (GAI) has sparked a surge in demand for advanced semiconductor chips, leading to a renewed focus on developing complex calculations for large-scale AI models and high-speed transmission interfaces. In response to this industry need, the Heterogeneous Integrated chiplet System Package (Hi-CHIP) Alliance has been formed, bringing together leading semiconductor companies from Taiwan and around the world. The alliance aims to provide comprehensive services ranging from packaging design and testing to pilot production, with the goal of enhancing high-end semiconductor manufacturing and integration capabilities.

Since its establishment in 2021, the Hi-CHIP Alliance has attracted key industry players such as EVG, Kulicke and Soffa (K&S), USI, Raytek Semiconductor, Unimicron, DuPont, and Brewer Science. This impressive lineup of members positions the alliance as a major player in the semiconductor industry. Looking ahead, the Hi-CHIP Alliance is eager to explore its global market potential and make a significant impact on the industry.

Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at ITRI and Chairman of the Hi-CHIP Alliance, emphasized the importance of advanced manufacturing processes in meeting the growing demands of IC design cycles and costs. To address these challenges, multi-dimensional chip design and heterogeneous integrated packaging architecture have become essential tools in semiconductor development. Furthermore, the rise of GAI applications like ChatGPT, which require substantial computing power and transmission speed, necessitates even higher levels of integration capacity in chip manufacturing.

ITRI has been at the forefront of developing manufacturing technologies and upgrading materials and equipment to enhance heterogeneous integration technologies. Notable achievements include fan-out wafer level packaging (FOWLP), 2.5D and 3D chips, embedded interposer connections (EIC), and programmable packages. With a diverse membership consisting of both local and foreign semiconductor manufacturers, the Hi-CHIP Alliance is establishing an advanced packaging process production line to provide a comprehensive one-stop service platform.

Nicky Lu, Chair of the AI-on-Chip Taiwan Alliance (AITA), highlighted the objectives of AITA, which include building an AI ecosystem, jointly developing critical technologies, and fostering collaboration to accelerate AI chip hardware, software, and product development. As a crucial component of AITA, the Hi-CHIP Alliance brings together significant semiconductor players from Taiwan and overseas. USI, Raytek, and Unimicron currently serve as the general coordinators for the Hi-CHIP Alliance, facilitating connections with related industries through AITA. This collaboration aims to establish a common verification platform, create a 3D/FO common technology platform, develop customized adoption models, and enhance core manufacturing process capabilities. The ultimate goal is to cultivate international partnerships, drive advancements in equipment and materials, and propel the semiconductor industry to new heights.

Technology Explained

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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