AMD’s x86 core roadmap reveals Zen 5 , (Nirvana) and Zen 6 , (Morpheus) microarchitectures in detail.

AMD Zen 5 , and Zen 6 , Details Leak: A Glimpse into the Future of AMD’s Zen Architectures

In an unexpected turn of events, Moore’s Law is Dead channel has shared exclusive details about AMD’s upcoming Zen architectures. These leaked slides, originally meant for internal use only, provide insights into the progress and strategies surrounding the next generation of Zen microarchitectures. While it’s important to note that these roadmaps cover a wide range of products, including both data center and consumer-oriented series, they offer tantalizing glimpses into what we can expect from AMD in the coming years.

Nirvana Zen 5 , (1H 2024): The Road to Ryzen 8000

One of the highlights of the leaked slides is the Nirvana Zen 5 , microarchitecture, set to power the Ryzen 8000 series. According to the information presented, we can anticipate a 10 to 15% increase in instructions per clock (IPC). However, it’s worth noting that these figures are still subject to verification by retail silicon. The slides also reveal some intriguing details, such as a 48K data cache, 8 wide dispatches, 6 arithmetic logic units (ALUs), FP-512 variants, and a new low power core option.

Perhaps most excitingly, the Nirvana Zen 5 , is rumored to offer a 16-core complex. This could potentially mean that gamers on the AM5 platform will have access to either 16-core Zen 5 , designs or a mix of 8-core Zen 5 , and 16-core Zen5c variants. The possibilities are certainly intriguing for those eagerly awaiting the next wave of AMD processors.

Morpheus Zen 6 , (2H 2025): Pushing the Boundaries Further

Looking even further into the future, we catch a glimpse of the Morpheus Zen 6 , microarchitecture. Set to utilize 3nm and 2nm process technology, Zen 6 , aims to achieve a 10% IPC increase over its predecessor, Nirvana. AMD has plans to introduce FP16 instruction for AI/ML algorithm acceleration, as well as a new memory profiler. Additionally, the core count is expected to rise to 32, although it’s important to clarify that this likely refers to Zen6c rather than Zen6.

According to the leaked information, Zen 6 , may feature a chip layout redesign similar to Zen2, incorporating new packaging techniques. While unconfirmed, there are whispers of AMD potentially exploring die stacking by placing CCDs on top of the IOD (input/output interface die). This would mark a significant departure from AMD’s traditional disaggregated chiplet design approach. However, we’ll have to wait for official confirmation to know for sure. Another aspect that remains uncertain is whether Zen 6 , will utilize the AM5 socket.

As with any leaked information, it’s important to approach these details with a healthy dose of skepticism. However, if these slides are indeed accurate, AMD enthusiasts have much to look forward to in the coming years. The Zen 5 , and Zen 6 , microarchitectures promise exciting advancements in IPC, core counts, and supported features. While we eagerly await official announcements from AMD, these leaks offer a tantalizing glimpse into the future of AMD’s Zen lineup.

Background Information

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About AMD:

AMD, a large player in the semiconductor industry is known for its powerful processors and graphic solutions, AMD has consistently pushed the boundaries of performance, efficiency, and user experience. With a customer-centric approach, the company has cultivated a reputation for delivering high-performance solutions that cater to the needs of gamers, professionals, and general users. AMD's Ryzen series of processors have redefined the landscape of desktop and laptop computing, offering impressive multi-core performance and competitive pricing that has challenged the dominance of its competitors. Complementing its processor expertise, AMD's Radeon graphics cards have also earned accolades for their efficiency and exceptional graphical capabilities, making them a favored choice among gamers and content creators. The company's commitment to innovation and technology continues to shape the client computing landscape, providing users with powerful tools to fuel their digital endeavors.

  

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Technology Explained

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AM5: Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Advanced Micro Devices, that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 replaces the Socket AM4 and is AMD's first LGA socket designed for mainstream, non-enthusiast CPUs.

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chiplet: Chiplets are a new type of technology that is revolutionizing the computer industry. They are small, modular components that can be used to build powerful computing systems. Chiplets are designed to be used in combination with other components, such as processors, memory, and storage, to create a complete system. This allows for more efficient and cost-effective production of computers, as well as more powerful and versatile systems. Chiplets can be used to create powerful gaming PCs, high-end workstations, and even supercomputers. They are also being used in the development of artificial intelligence and machine learning applications. Chiplets are an exciting new technology that is changing the way we build and use computers.

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